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In situ observation of twin boundary migration in copper with nanoscale twins during tensile deformation 

Authors: Y. B. Wang a;  M. L. Sui a; E. Ma b
Affiliations:   a Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
b Department of Materials Science and Engineering, The Johns Hopkins University, Baltimore, MD 21218, USA
DOI: 10.1080/09500830701591493
Publication Frequency: 12 issues per year
Published in: journal Philosophical Magazine Letters, Volume 87, Issue 12 December 2007 , pages 935 - 942
Formats available: HTML (English) : PDF (English)
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Abstract

In situ transmission electron microscopy observations are reported of the dynamic process of twin boundary migration in Cu with nanoscale twins. The experiment provides the first direct evidence of twin boundary migration via Shockley partial dislocation emission from the twin boundary/grain boundary intersections, and reveals that such migration is the dominant deformation mechanism in the initial stage of plastic straining. The behaviour is discussed in comparison with molecular dynamics simulations and in terms of the unique characteristics of the sample microstructure.
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