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Nanoscale and Microscale Thermophysical Engineering, Volume 9 Issue 3 2005

ISSN: 1556-7273 (electronic) 1556-7265 (paper)
Publication Frequency: 4 issues per year
Previously published as: Microscale Thermophysical Engineering (1089-3954, 1091-7640) until 2005
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Original Articles
Surface Micro-Profiling for Reduced Energy Dissipation and Exergy Loss in Convective Heat Transfer
G. F. Naterer
Pages 213 – 236
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Interface Motion Driven by Capillary Action in Circular and Rectangular Microchannel
Naoki Ichikawa; Ryutaro Maeda
Pages 237 – 254
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Cell-Surface Adhesive Interactions in Microchannels and Microvessels
Michael R. King
Pages 255 – 264
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Molecular Thermal Phenomena in an Ultrathin Lubrication Liquid Film of Linear Molecules Between Solid Surfaces
Taku Ohara; Daichi Torii
Pages 265 – 279
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Numerical Simulation of Micro Flow-Through PCR Chip
Wei Wang;  Zhi-Xin Li; Zeng-Yuan Guo
Pages 281 – 293
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Interface Structure Influence on Thermal Resistance Across Double-Layered Nanofilms
Xin-Gang Liang; Lin Sun
Pages 295 – 304
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Simulation of Flow and Mass Transport in a Meander Microchannel Subject to Electroosmotic Pumping
Dominik P. J. Barz; Peter Ehrhard
Pages 305 – 316
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