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Heat Transfer Engineering, Volume 29 Issue 2 2008

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Increasing to 14 issues per year in 2009
ISSN: 1521-0537 (electronic) 0145-7632 (paper)
Publication Frequency: 14 issues per year
Subject: Heat Transfer;
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editorial
Recent Topics in Electronics Cooling—From Transistors to Systems
Wataru Nakayama; Sung Jin Kim
Pages 117 – 119
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feature articles
Electro-Thermal Behavior of a Sub-Micrometer Bulk CMOS Device: Modeling of Heat Generation and Prediction of Temperatures
Tomoyuki Hatakeyama; Kazuyoshi Fushinobu
Pages 120 – 133
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Thermo-Mechanical Challenges in Stacked Packaging
Dereje Agonafer;  Abhijit Kaisare;  Mohammad M. Hossain;  Yongje Lee;  Bhavani P. Dewan-Sandur;  Terry Dishongh; Senol Pekin
Pages 134 – 148
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Ten Years of Boundary-Condition- Independent Compact Thermal Modeling of Electronic Parts: A Review
Clemens J. M. Lasance
Pages 149 – 168
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Comparison of Fluid Flow and Thermal Characteristics of Plate-Fin and Pin-Fin Heat Sinks Subject to a Parallel Flow
Sung Jin Kim;  Dong-Kwon Kim; Hwan Hee Oh
Pages 169 – 177
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Challenges in Cooling Design of CPU Packages for High-Performance Servers
Jie Wei
Pages 178 – 187
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A CFD Study on the Effect of Shrinking Box Size on Cooling Airflows in Compact Electronic Equipment—The Case of Portable Projection Display Equipment
Luke Maguire;  Wataru Nakayama;  Masud Behnia; Yoshihiro Kondo
Pages 188 – 197
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A Proper Orthogonal Decomposition Based System-Level Thermal Modeling Methodology for Shipboard Power Electronics Cabinets
Syed I. Haider;  Ludovic Burton; Yogendra Joshi
Pages 198 – 215
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