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The Journal of Adhesion, Volume 84 Issue 7 2008

Access Free Articles from Volume 85, Issue 8 of the Waite Collection in Journal of Adhesion
ISSN: 1545-5823 (electronic) 0021-8464 (paper)
Publication Frequency: 12 issues per year
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Original Articles
Moisture Diffusion in Carbon/Epoxy Composite and the Effect of Cyclic Hygrothermal Fluctuations: Characterization by Dynamic Mechanical Analysis (DMA) and Interlaminar Shear Strength (ILSS)
Sohaib Akbar; Tao Zhang
Pages 585 – 600
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Adhesion Studies on Piperylene-Styrene Copolymer Modified Polychloroprene Adhesive: Phase Morphology and Surface Composition
Kristina Žukienė;  Virginija Jankauskaitė; Kazys Vytautas Mickus
Pages 601 – 618
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Subcritical Delamination in Epoxy Bonds to Silicon and Glass Adherends: Effect of Temperature and Preconditioning
Hitendra K. Singh;  Kai-Tak Wan;  John G. Dillard;  David A. Dillard;  Paul Reboa;  Joshua Smith;  Ellen Chappell; Alok Sharan
Pages 619 – 637
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Thermosetting Adhesive Based on Tannin and Poly(N-Hydroxymethyl Acrylamide)
Gun Nakanishi;  Tadashi Okamoto; Masahiro Takatani
Pages 638 – 652
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Reaction of Catechin and Tannin with N-Hydroxymethylacrylamide
Gun Nakanishi;  Tadashi Okamoto; Masahiro Takatani
Pages 653 – 663
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The Presence of Adsorbed Proteins on Particles Increases Aggregated Particle Sedimentation, as Measured by a Light Scattering Technique
K. D. McKeon; B. J. Love
Pages 664 – 674
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Defect Dependent Adhesion of Fibrillar Surfaces
Robert M. McMeeking;  Eduard Arzt; Anthony G. Evans
Pages 675 – 681
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