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Volume 85 Issue 4 & 5
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Reprints
The Journal of Adhesion
, Volume
85
Issue 4 & 5 2009
Papers from the 2nd International Conference on Advanced Computational Engineering and Experimenting (ACE-X 2008), Barcelona, Spain, 14–15 July 2008. Part 1
ISSN:
1545-5823 (electronic) 0021-8464 (paper)
Publication Frequency:
12 issues per year
Subjects:
Adhesives
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Chemistry
;
Materials Chemistry
;
Materials Science
;
Publisher:
Taylor & Francis
Issue Purchase: US$380.51 -
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Editorials
Guest Editorial
Lucas F. M. da Silva; Andreas Öchsner
Pages 157 – 159
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Nanocomposites of Epoxy with Electrospun Carbon Nanofibers: Mechanical Behavior
Erol Sancaktar; Darunee Aussawasathien
Pages 160 – 179
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Nanoreinforced Epoxy Adhesives for Aerospace Industry
S. G. Prolongo; M. R. Gude; J. Sanchez; A. Ureña
Pages 180 – 199
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Mechanical Properties of Modified Epoxies as Related to Free Volume Parameters
A. M. A. M. Altaweel; C. Ranganathaiah; B. Kothandaraman
Pages 200 – 215
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Effect of Boron Carbide Filler on the Curing and Mechanical Properties of an Epoxy Resin
J. Abenojar; M. A. Martínez; F. Velasco; V. Pascual-Sánchez; J. M. Martín-Martínez
Pages 216 – 238
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2-D Modeling of the Behavior of an Adhesive in an Assembly Using a Non-Associated Elasto-Visco-Plastic Model
R. Créac'hcadec; J. Y. Cognard
Pages 239 – 260
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Mechanical Characterization of Flexible Adhesives
Mariana D. Banea; Lucas F. M. da Silva
Pages 261 – 285
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